Tungsten-Copper Alloy

Welding Positions:

Detail:

Tungsten-Copper Alloy.Tungsten-Copper Alloy is composed of tungsten and copper alloy. Commonly used alloys of copper content of 10% ~ 50%. Preparing alloy by powder metallurgy method, has the very good conductive thermal conductivity, good high temperature strength and plasticity. At high temperatures, such as more than 3000 ℃, be evaporated liquefied alloy of copper, a large number of absorbing heat, reduce the material surface temperature

Comprehensive advantages of tungsten and copper, tungsten copper alloy, with high temperature resistance, erosion resistance, high strength, better than big, conductivity, easy to machining, and sweat cooling characteristics, as the electrical materials, electrode materials, electronic packaging materials, and the rockets and missiles special-purpose materials are widely used in machinery, electric power, electronics, metallurgy, aerospace industry.

The production of tungsten and copper/copper composite contactor does not contain the third alloy elements, after more than 2000 ℃ high temperature sintering tungsten matrix, as a whole through high vacuum processing, has the material evenly, gas and low content of impurities, high conductivity and good composite interface, copper layer density, etc. Over the years, the vast majority of domestic vacuum load switch tube manufacturers are using compound contact my company. Hundreds of thousands of pieces of the production capacity can meet the needs of all customers.

Product performance: high corrosion rate, low attrition rate, electrode shape precision, excellent processing performance, good surface quality of the work piece WC.

with different matrix matching of thermal expansion coefficient and high thermal conductivity; Excellent high temperature stability and uniformity; Excellent processing performance;

Advantages:

Electronic packaging materials and heat sink materials, W - Cu electronic encapsulation materials, has low expansion properties of tungsten, but also has high thermal conductivity characteristics of copper, what particularly valuable is that its thermal expansion coefficient and thermal conductivity can adjust the composition and material design, thus the application of this material has brought great convenience. We adopt high purity high quality raw material, after pressing, high temperature sintering and melt permeability, got the good performance of W - Cu electronic packaging materials and heat sink materials.With high power device packaging materials, such as substrate and electrode; High performance of lead frame; Thermal control devices of military and civilian thermal control panel and radiator.