Tungsten Sputtering Targets

Detail:

Sputtering target material by magnetron sputtering and arc ion plating or other types of sputter deposition system in the appropriate technical conditions in a variety of functional thin film is formed on substrate sputtering source. In the sputtering target pole (cathode) between the anode and an orthogonal magnetic and electric fields, in the high vacuum chamber by filling the need of inert gas (usually the Ar gas), under the action of electric field, Ar gas ionization into positive ions and electrons, target and has certain negative pressure, from the target from the pole by the effect of magnetic field and the working gas ionization probability increase, form a high density plasma near the cathode, Ar ion under the action of lorentz force, speed up to fly to the target surface, bombarding target surface at a high speed, the target is follow the principle of momentum transfer atoms sputtering out by higher kinetic energy from the target surface to substrate deposition film.

Target material involving the metal, nonmetal, ceramic, and their compounds, compounds. Due to the different characteristics of the material, and they were used in preparation of a sputtering target material by vacuum sputtering on different body become continuous membrane layer, bring new features is originally the body material.

Sputtering coating is mainly used in: flat-panel displays, coated glass industry (mainly including architectural glass, automotive glass, optical thin film glass, etc.), thin film solar, surface engineering & tools (decoration), magnetic, optical recording medium, microelectronics, automobile lamp, decorative coating, etc.